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Embedded Computer Module Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Embedded Computer Module Product List

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COM-Express Type 6『PCOM-B646』

COM-Express Type 6『PCOM-B646』

Available for various embedded and industrial applications with a flexible interface configuration!

The PCOM-B646 is a COM-Express Type 6 module equipped with Intel's Amston Lake generation processor. Despite its low power consumption with a maximum TDP of 15W, it supports some extended operating temperature ranges, making it versatile for various applications. This platform supports AVX2 VNNI and can be enhanced with up to 8 cores, improving performance for tasks such as AI inference. 【Features】 ■ Equipped with Intel Atom x7000E series & Intel i3-N series ■ Supports up to 48GB of DDR5-4800MT/s SO-DIMM ■ Capable of independent triple display output ■ Supports industrial temperature range of -40°C to 85°C (for some SKUs) ■ CAN bus option available *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors

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COM-HPC Server module "PCOM-B801GT"

COM-HPC Server module "PCOM-B801GT"

The onboard option for NVMe storage matches applications that require fast data access!

The 『PCOM-B801GT』 is a COM-HPC Server size D module equipped with up to 24 cores of the Intel Atom P5300 series. All SKUs support extended temperature ranges and can accommodate up to 4 DDR4 memory modules. With Intel Quick Assist Technology (Intel QAT), it can offload and accelerate the compression and encryption of critical data. 【Features】 ■ Equipped with Intel Atom P5300 series processor ■ Can accommodate up to 4 DDR4 So-DIMM modules ■ Supports an operating temperature range of -40℃ to 85℃ ■ In addition to PCI-Express Gen3x16, it supports 10GbE KR with 8 lanes ■ Optionally supports onboard NVMe SSD *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors

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COM-HPC client module 'PCOM-B886'

COM-HPC client module 'PCOM-B886'

Supports PCIe Gen5x8, 2xPCIe Gen4x4, and 12xPCIe Gen4x1! A variety of interfaces including USB4.

The PCOM-B886 is a COM-HPC client module with a size of B (120×120mm) equipped with an Intel Core Ultra 200U/H series processor. It supports 2xDDR5 So-DIMM and optionally supports onboard NVMe SSDs. Please feel free to contact us if you have any inquiries. 【Features】 ■ Equipped with Intel Core Ultra 200U/H series processor ■ Supports PCIe Gen5x8, 2xPCIe Gen4x4, 12xPCIe Gen4x1 ■ Supports 2xDDR5 So-DIMM ■ Various interfaces including USB4 ■ Optionally supports onboard NVMe SSD *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors

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COM-Express Type 6『PCOM-B657VGL』

COM-Express Type 6『PCOM-B657VGL』

Some industrial processors are guaranteed to operate at temperatures ranging from -40 to 85°C!

The "PCOM-B657VGL" is a COM-Express Type 6 module compatible with the 11th generation mobile Intel Core processors. It can be equipped with processors for embedded and industrial use, with the latter having a wide operating temperature range of -40 to 85°C, making it suitable for outdoor and freezing environments. It also supports ECC, allowing for safe use in mission-critical applications such as financial machines. PCI Express supports the latest Gen4, making it compatible with cutting-edge graphics cards and NVMe. 【Features】 ■ Equipped with Intel 11th generation mobile Core, Celeron, and Xeon W-1100E series processors using a 10nm process ■ Supports processors with up to 8 cores/16 threads and power consumption ranging from 25W to 45W ■ Capable of supporting large capacity memory of up to 64GB (DDR4 3200MT/s) ■ Equipped with PCI Express 4.0 x 16 lanes and PCI Express 3.0 x 8 lanes *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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AAEON module "COM-TGUC6"

AAEON module "COM-TGUC6"

Supports new I/O specifications! It is equipped with the ability to support up to four independent displays.

The COM-TGUC6 is a module equipped with the 11th generation Intel Core U processor in a compact COM Type 6 form factor. It provides powerful processing capabilities along with support for new I/O specifications, enabling faster and more flexible connections, including 2.5Gbps Ethernet. It supports DDR4 modules with speeds of up to 3200MHz, and when using industrial Intel Core processors, it can operate in temperatures ranging from -40°C to 85°C. 【Features】 ■ Equipped with the 11th generation Intel Core U Processor (C/N#TigerLake) ■ Achieves high processing speeds for intensive applications ■ Supports industrial models of Intel Core processors ■ Guarantees reliable operation ■ Supports new I/O specifications *For more details, please refer to the PDF document or feel free to contact us.

  • Other embedded systems (software and hardware)

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Compact computer module suitable for AI machine development *Utilization materials available.

Compact computer module suitable for AI machine development *Utilization materials available.

A must-see for those considering the introduction of AI features into their products! By using SoM, you can easily and cost-effectively implement it in a short period of time. *We are currently offering a total of 8 introductory materials.

Fujisoft Inc. offers a wide range of System on Module products to our customers. In addition to handling products, we also engage in contract development of software and hardware, utilizing System on Module for our development projects. By leveraging System on Module products, the integration of "in-house products × AI implementation" becomes easy, quick, and cost-effective. This is because small computer module (System on Module) products provide the necessary hardware and software for AI implementation in a unified manner. Specifically, functions essential for AI, such as processor cores, communication interfaces, and memory blocks, are integrated, significantly reducing the effort required for development and implementation. This document (comprising 8 types) introduces the benefits of adopting small computer modules and their usage, as well as a white paper highlighting the advantages of "industrial robots × SoM." It also includes brochures introducing each SoM product and case studies (demos) of their applications. If you are interested in AI implementation, we encourage you to read this document.

  • Embedded Board Computers
  • Industrial PCs
  • Expansion Boards

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i.MX93SODIMM SoM iW-RainboW-G50M

i.MX93SODIMM SoM iW-RainboW-G50M

Built-in scalable Arm Cortex-A55 cores! Enhances performance and energy efficiency.

We would like to introduce the 'i.MX 93 SODIMM SOM iW-RainboW-G50M' that we handle. It provides efficient machine learning (ML) acceleration and advanced security through the built-in EdgeLock Secure Enclave, supporting energy-efficient edge computing. Additionally, it is equipped with the Arm Ethos-U65 microNPU, enabling high-performance, cost-effective, and energy-efficient ML applications. 【Features (partial)】 ■ i.MX 93 CPU with 64-bit ARM v8.2-A Architecture ■ NPU with up to 0.5 TOP/s Neural Network performance ■ IEEE 802.11b/g/n/ac/ax Wi-Fi & Bluetooth 5.3 ■ Supports Cortex-A55 cores ■ Supports 1 × 1Gbps Ethernet *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers

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ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR

ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR

For vertical markets such as industry, healthcare, automotive, and avionics! Providing high-performance features.

We would like to introduce the "ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR–Zynq UltraScale+ RFSoC System on Module iW-RainboW-G60M" that we handle. It is equipped with a quad-core Cortex-A53 CPU and dual Cortex-R5F CPUs, along with 8GB DDR4 RAM with ECC, 32GB eMMC flash, and 256MB QSPI flash. Additionally, it offers high-performance features such as up to 930k logic cells, 16xPL-GTY transceivers (up to 28.21Gbps), 8-channel ADC (up to 5Gsps), and 8-channel DAC (up to 9.85Gsps), and it can operate in a temperature range of -40°C to +85°C. 【Features (partial)】 ■ Zynq Ultrascale+ RFSoC family with FFVG1517 Package ■ Compatible with 48/47/43/28/27/25DR devices *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers

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iW-RainboW-G59M

iW-RainboW-G59M

Supports various high-speed interfaces and operates within a temperature range of -40°C to +85°C!

The "TI DRA821Ux Based OSM SoM iW-RainboW-G59M" features a dual Arm Cortex-A72 processor at 2GHz and four Arm Cortex-R5F cores, providing excellent computational power. Additionally, it is equipped with 2GB of LPDDR4 memory (expandable up to 8GB) and 16GB of eMMC flash. It also supports a variety of high-speed interfaces (PCIe, SGMII, USB 3.0, RGMII, CAN, I2C, SPI, etc.) and operates within a temperature range of -40°C to +85°C. 【Features】 ■ AM62Lx with 64-Bit Dual Arm Cortex-A53 ■ 1GB LPDDR4 expandable up to 2GB ■ 8GB eMMC Flash expandable ■ 2 x 1Gb RGMII ■ OSM v1.2 Size-SF LGA Solderable Module ■ Form Factor: 30mm x 30mm *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers
  • Other embedded systems (software and hardware)

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SMARC module "PSMC-M640F"

SMARC module "PSMC-M640F"

Qseven module equipped with Freescale i.MX6 series

The Qseven module "PSMC-M640F" is equipped with the Freescale i.MX6 series and supports onboard DDR3 system memory of up to 2GB, with 1GB onboard. For more details, please download the catalog.

  • Industrial PCs

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NXP i.MX8M Plus equipped with OSM【OSM-IMX8MP】

NXP i.MX8M Plus equipped with OSM【OSM-IMX8MP】

NXP i.MX8M Plus series equipped OSM Size L module

The OSM-IMX8MP is an OSM R1.1 size-L module equipped with the NXP i.MX 8M Plus series processor featuring a 4-core Arm Cortex-A53 and M7, up to 8GB of LPDDR4L memory, and up to 128GB of eMMC storage. This module, which includes an InSoC 2.3 TOPS NPU and Vivante GC7000UL graphics, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX8MP module supports HDMI, LVDS, and DSI graphics outputs, 2x GbE (1 TSN compliant), 2x CAN bus, I2S audio codec interface, USB 3.0 and USB 2.0 interfaces, and MIPI-CSI, with a product supply capability of 15 years.

  • Embedded Board Computers

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【Trading Manufacturer】congatec

【Trading Manufacturer】congatec

Computer on Module! Providing high-dimensional quality and unwavering reliability.

At Ryo-Yo Electro Co., Ltd., we handle products from congatec, which provides advanced engineering services. Congatec offers a variety of products and services, including embedded module products and virtualization systems for embedded applications. They provide scalable performance along with high-level quality and unwavering reliability. 【Product Examples】 ■ Module 'Qseven' ■ Module 'SMARC 2.1' ■ Module 'COM Express' ■ Module 'COM-HPC' ■ Virtualization system for embedded applications 'Real-Time Hypervisor (RTH)' *For more details, please refer to the PDF materials or feel free to contact us.

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  • Other semiconductors

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iW-RainboW-G15M-Q7

iW-RainboW-G15M-Q7

1000/100/10Mbps Ethernet! Over 10 years of product lifespan program.

We would like to introduce the 'iW-RainboW-G15M-Q7' that we handle. This product is equipped with an i.MX 6 QP/DP/Q/D/DL/S core CPU. Additionally, it features a modular and compact Qseven form factor. 【Features】 ■ i.MX 6 QP/DP/Q/D/DL/S core CPU ■ Multi-format HD1080p encoding and decoding ■ OpenGL ES2.0 ■ OpenVG1.1 graphic accelerator ■ Over 10 years of product lifespan program *For more details, please refer to the PDF document or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS

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iW-RainboW-G27M-Q7

iW-RainboW-G27M-Q7

64-bit ARMv8 architecture CPU! Over 10 years of product lifespan program.

We would like to introduce the "iW-RainboW-G27M-Q7" that we handle. This product features the i.MX 8 QuadMax/QuadPlus Qseven SOM equipped with the i.MX 8 QM/QP CPU. Additionally, it is a SOM compatible with Q7 v2.1. Please feel free to consult us when you need assistance. 【Features】 ■ i.MX 8 QM/QP CPU ■ Support for multi-OS platforms ■ Over 10 years of product lifespan program ■ IEEE802.11a/b/g/n/ac/ax Wi-Fi ■ Bluetooth 5.0 ■ Q7 v2.1 compatible SOM *For more details, please refer to the PDF document or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS

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iW-RainboW-G55M

iW-RainboW-G55M

It comes with 2GB of LPDDR4 memory expandable up to 8GB and 16GB of eMMC flash!

The "TI AM62Ax Based OSM-LF Module iW-RainboW-G55M" features a dual Arm Cortex-A72 processor @2GHz and four Arm Cortex-R5F cores, providing excellent computing power. It supports a variety of high-speed interfaces (such as PCIe and SGMII) and operates within a temperature range of -40°C to +85°C. Additionally, it is equipped with 2GB of LPDDR4 memory (expandable up to 8GB) and 16GB of eMMC flash. 【Features (partial)】 ■ AM62Ax with 64-Bit Quad Arm Cortex-A53 ■ Dual core ARM Cortex-R5F Subsystem ■ 2GB LPDDR4 Expandable up to 8GB and 16GB eMMC Flash ■ C7xV-256 Deep Learning Accelerator (2 TOPS) *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers
  • Other embedded systems (software and hardware)

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